Adding Non-Electrical and Non-Electronic Parts, Accessories, Processes, etc.

 

This feature of the Unisoft software allows you to add parts, processes, and other items that are not part of the actual electrical circuitry on the PC board. These elements can then be assigned to individual assembly process steps and treated like any other step within the Unisoft software. You can add just a few additional steps or, if desired, define the entire PCB assembly process—from the pre-assembly stage to the main assembly stage, and continuing through the point at which the fully assembled PCB is integrated into its subassembly.

For instance, if you need to manually add pcb card ejectors, you can enter that item along with corresponding annotation text, notes, and pictures. You can then apply it to a specific assembly step and treat it just like any other process step in the Unisoft software.  Then as in the figure below, you can print or display that assembly step.

 

 

Below are some examples of non-electrical parts and processes that can be involved in completing a PCB assembly. You may also create as many steps as desired—for example, you can extend your steps to include pre-assembly and post-assembly processes and examples are listed below.

ASSEMBLY:

• Adhesives - Epoxy Or Silicone Potting For Moisture Or Vibration Resistance
• Adhesives - Conformal Coating Protective Layer Encapsulation
• Adhesives - Hot Melt Glue / RTV Silicone / Double-Sided Tape / Adhesive Strips For Securing Parts
• Adhesives - Loctite / Threadlocker For Securing Screws And Fasteners
• Adhesives - Thermal Epoxy Or Paste For Bonding Heatsinks
• Backplane Systems, Enclosures, Industrial Racks, Etc.
• Bezels
• Brackets
• Cables
• Cable Routing And Securing – Zip Ties, Cable Guides, Adhesive Mounts
• Card Guides Or Rails – For Insertion Into Chassis Slots
• Cleaning (E.G., IPA Wash) – Removing Flux Or Residue
• Connectors And Sockets (Non-SMD)
• Card Ejectors
• Card Stiffeners
• Edge Connectors
• Foam
• Frames
• Gaskets
• Heatsinks
• Inspection Checklists – To Confirm Final Build Completeness
• Insulator Pads
• Labels
• Mounting Brackets Or Flanges – To Secure The PCB In Enclosures
• Protective Covers
• Screws, Nuts, And Washers – For Fastening PCBs To Standoffs Or Enclosures
• Security Seals / Tamper Evident Tape – Compliance Or Warranty-Related
• Serial Number Tags
• Shields (EMI/RFI) - Metal Shielding Cans, Etc. For EMI Shielding
• Spacers / Standoffs
• Testing Processes - Functional / Electrical Testing

 

PRE-ASSEMBLY:

• Data Intake & Review - CAD, BOM, Gerbers, etc.
  
- Collect and verify:
   - BOM (Bill of Materials)
   - Pick-and-place file (XY, XYR, CAD, Centroid, etc.)
   - Gerber files (including paste, mask, silkscreen, copper layers, drills)
   - Netlist
   - Drill file (Excellon format or similar)
   - Special customer instructions (e.g., polarity markings, DNPs)
   - PCB stack-up or fabrication drawing
   - Test procedures or software (if provided)
   - Assembly drawings or mechanical drawings
   - Stencil design (or create internally)


• Engineering Review and DFM/DFT Checks
  
- Confirm component clearances and spacing
- Check for potential tombstoning, insufficient pads, and unmasked vias
- Identify fiducials, tooling holes, board edge clearance
- Assess for ICT or flying probe access (DFT)
- Validate thermal profiles for reflow compatibility
- Evaluate if fine-pitch BGAs, via-in-pad, or bottom-terminated components require special handling
- Check for mixed technology (SMT + THT) and evaluate soldering approach


• BOM Validation & Parts Management
  
- Cross-check:
   - Part number consistency
   - Package types and orientations
   - Reference designators match pick-and-place data
   - DNPs (do not place) clearly indicated
- Check:
   - Inventory availability
   - Procurement of missing parts
   - Lead times on long-delivery items
- Review:
   - Obsolete or EOL parts and alternatives
   - Manufacturer part number conflicts
- Handle:
   - Special storage needs (MSL, ESD)
   - Customer-supplied parts (consigned inventory)


• PCB Fabrication Coordination
  
- Finalize:
   - PCB specs (layer count, finish, copper weight, etc.)
   - Material (e.g., FR4, Rogers, polyimide)
   - Impedance control if needed
- Panelization:
   - Define panel array layout, tooling strips, fiducials, breakaways (V-score or routed tabs)
   - Account for wave solder pallets if needed
- Confirm:
   - Bare board inspection requirements
   - Certificates of conformance (RoHS, lead-free)


• Stencil Creation / Approval
  
- Generate stencil aperture data (from paste Gerber)
- Adjust:
   - Paste reduction, rounded apertures, home-plate designs, etc.
- Select:
   - Stencil thickness (typically 4–8 mils)
   - Stainless steel vs. nano-coated
- Coordinate:
   - With vendor or create in-house
   - Approval before manufacturing


• Assembly Documentation Package Creation
  
- Create or validate:
   - Assembly drawings with polarity and part markings
   - Placement printouts for operators and inspectors
   - Process flowcharts by step (paste print, placement, reflow, inspection, etc.)
   - Rework instructions and customer quality standards
   - Barcoding and labeling instructions
- Include:
   - Revision control documentation
   - Traceability requirements
   - Serialization methods if requested


• Parts Receiving, Inspection & Storage
  
- Receive components:
   - Customer consigned or from procurement
- Perform:
   - Incoming quality inspection
   - Visual and dimension checks if needed
   - Lot and date code recording
- Log:
   - MSL handling (track exposure time and re-bake if necessary)
- Store:
   - In ESD-safe, humidity-controlled environments


• Kitting & Job Prep for Production Floor
  
- Pull all components from inventory and group by job
- Label and organize:
   - Per feeder or tray location
   - Separate SMT vs. THT bins
- Include:
   - Extra parts for setup, attrition, and testing
- Print and include:
   - Feeder setup sheets
   - Staging checklists
   - Operator instructions
- Confirm:
   - All materials (boards, parts, stencil, fixtures) are gathered
   - Floor traveler or job packet assembled
- QA double-check:
   - Complete kit integrity before releasing to the floor


• Machine Programming & Setup
  
- SMT Pick-and-Place:
   - Load placement files into machine software
   - Map parts to feeder slots
   - Assign nozzle tools and check orientation
- Screen Printer:
   - Load stencil and align fiducials
   - Load paste profile (pressure, speed, snap-off)
- Reflow Oven:
   - Select or tune temperature profile based on solder paste
- AOI/Inspection Systems:
   - Program inspection for reference components
- ICT/Functional Test:
   - Load test software or bed-of-nails test program


• Production Scheduling & Readiness
  
- Book:
   - Production time on assembly line
- Assign:
   - Operators, inspectors, and support personnel
- Perform:
   - Line setup dry run (optional)
   - Pre-checks: stencil, feeders, boards, air pressure, oven temp
- Conduct:
   - Pre-run team meeting (review process flow, risks, special instructions)
- Final QA signoff:
   - Confirm release-to-floor checklist complete

 POST-PCB ASSEMBLY:

• Inspection & Testing
  
- Visual Inspection (manual or with magnification)
- Automated Optical Inspection (AOI)
- X-Ray Inspection (for BGAs and inner-layer defects)
- In-Circuit Testing (ICT) – Bed-of-nails or fixtureless
- Flying Probe Testing – Non-contact probing
- Functional Testing (FCT) – Power-up and run actual firmware/software
- Boundary Scan / JTAG
- Power-On Self Test (POST)
- Signal Integrity / Impedance Testing – For high-speed designs
- HiPot Testing – High-voltage insulation resistance testing
- Continuity Testing – Open/short detection
- Fixture Setup and Validation – Custom test fixtures for ICT/FCT


• Cleaning & Residue Removal
  
- Aqueous Cleaning – Batch or in-line
- Solvent-Based Cleaning – For no-clean flux or special chemistries
- Ultrasonic Cleaning
- Manual Cleaning with IPA
- Deionized Water Rinse
- Drying Ovens / Forced Air


• Identification, Labeling & Documentation
  
- Serial Number Labels (Barcodes, QR codes, DataMatrix)
- MAC Address or UID Assignment
- Revision Control Labels
- Work Traveler Updates / Routing Sheets
- Test Logs and Certifications
- Photographic Documentation
- Digital Traceability Logs (via MES system)


• Protective Coatings & Materials
  
-Conformal Coating (Spray, Dip, Selective)
- Potting and Encapsulation – Full or selective
- Underfill for BGAs
- Edge Sealing
- Thermal Interface Material Application
- Vibration Dampening Gel or Foam


• Mechanical Assembly
  
- Mounting to Metalwork / Frames / Chassis
- Attachment of Heatsinks or Thermal Pads
- Screws, Rivets, Clips, Stand-Offs Installation
- Mounting of Non-Electrical Components (card ejectors, guides, stiffeners)
- Integration into Racks, Subassemblies, or Final Products


• Environmental and Stress Testing
  
- Burn-In Testing – Run for extended periods under load
- Thermal Cycling
- Environmental Stress Screening (ESS)
- Vibration Testing
- Humidity Chamber Testing
- Salt Fog / Corrosion Testing
- Electrostatic Discharge (ESD) Testing
- EMI/EMC Pre-Compliance Testing


• Software & Configuration
  
- Firmware Upload / Flash Programming
- Bootloader Programming
- Serial Number / MAC / Configuration File Loading
- Security Key Injection (if applicable)
- BIOS/UEFI or CPLD/FPGA Programming
- Product Configuration and Calibration
- Validation of I/O ports, wireless modules, sensors, etc.


• Final QA / Quality Assurance
  
- Final Quality Audit
- Operator Sign-Off on Build Traveler
- First Article Approval (if applicable)
- MRB (Material Review Board) Handling
- Customer-Specific QA Steps
- Packaging Inspection
- Regulatory Labeling (UL, CE, FCC, RoHS, etc.)


• Packaging for Shipment
  
- Anti-Static (ESD-Safe) Bagging
- Moisture Barrier Bagging + Desiccants + Humidity Indicators
- Foam, Bubble Wrap, and Bracing for Fragile Units
- Custom Packaging / Kitting per Customer Requirements
- Serialized Labeling on Box
- Palletization & Load Stability Checks
- Shipping Documents, BOLs, Customs Forms


• Customer Delivery & Field-Readiness
  
- Final Assembly into System Enclosures (if required)
- User Documentation or Manual Insertion
- Software Licensing and Activation Keys
- Final Configuration Testing in System Environment
- Customer-Specific Checklist Completion
- On-Site Install Kits, Tools, or Instructions
- Integration with ERP or Inventory System for Shipment Notification


• Regulatory & Compliance
  
- RoHS / REACH Declarations
- UL / CE Certification Processes
- Export Control (ITAR, EAR)
- Conflict Minerals Reporting
- First Article Inspection Reports (FAIR)
- IPC-A-610 Class Verification (Class 2 / Class 3 standards)

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Here is an example of how a card ejector can be added.   

For this example, we’ve added an extra step—Step 6—to manually insert a non-electrical part, specifically a card ejector, onto the PCB.  

       Note: The first step shown below is the only required step when using the feature “Non-Electrical Parts, Accessories, Processes…”.   All other steps are optional and use additional features
                  of the software to aid in building fast and accurate assemblies. These features allow you to assign process step numbers, pictures, text, etc. to generate completed assembly documentation.



The process described below assumes a basic working knowledge of the Unisoft software. Please contact us if you would like a review of this feature.

The first step is to click the “Non-Electrical Parts, Accessories, Processes…” option found under either the “Assembly Sheets/1st Article” menu or the “Edit” menu. After selecting the menu item, a cursor appears with the letters "NE" next to it. The user then moves the cursor to either an empty area on the board to create a new item, or to an existing non-electrical item to edit or delete it, and left-clicks the mouse. If the cursor is in an empty area, an entry window with blank fields appears. The user fills in the fields in the window and clicks “Add” to create a new non-electrical item at the cursor. The new item, labeled "Cardeje1" as its reference designator, is added along with its part number and other relevant details. 

Note: From this window, you can also copy, find, and delete these Non-Electrical Parts.

 

At this point, for this non-electrical item just created, we have access to all the standard features of the Unisoft software that are available for any electrical component on the PC board. So we can assign it to any process step, add annotations, print it out, blink it, check it off for inspection, etc.—whatever we want to do.

Next, we create and assigned one annotation containing text and another containing a picture.

We then associate this non-electrical assembly operation with Process Step Number 6.

In the example shown in the figure below, we use the standard Unisoft “Print Assembly Document” feature to print Step Number 6. If you choose not to print, the operator can simply work from the on-screen display and complete the assembly—just like with any other step operation.

 

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